H3C S10500X-G is a high-end Switch series designed for the core layer in intelligent Campuses and cloud computing Data Centers. Powered by the H3C COMWARE 7 network operating system, the S10500X-G offers a comprehensive set of features tailored to both campus and data center environments, providing a secure and flexible platform for diverse types of network traffic. Architecturally, the S10500X-G adopts an industry-leading orthogonal CLOS+ forwarding architecture, ensuring long-term networking capabilities, making S10500X-G capable of building a high-performance network for years to come. In terms of services, with PoE++ capability, EERN (Enhanced Ethernet Ring Network) technology, and a variety of GE/10GE/25GE/40GE/100GE/400GE cards, along with wireless AC module, S10500X-G provides complete solutions for a wide range of scenarios. To ensure the network operating continuity, the S10500X-G delivers carrier-level reliability, features redundant designs across key components including the Engine units (MPU), Switch Fabric units, fan trays, and power supply modules. Additionally, the S10500X-G embraces a Green and environmentally friendly design philosophy, with intelligent cooling system and reduced power consumption to promote energy efficiency.
The S10500X-G series includes several different chassis models, S10506X-G, S10508X-G and S10512X-G, with different port density and performance to fit different network scales.
S10500X-G
H3C
New
1 Year
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S10500X-G incorporates the following advanced designs:
CLOS+ architecture and non-backplane design: Data center level forwarding architecture, separates the forwarding plane and control plane completely and high level of bandwidth scalability, building a non-blocking campus network.
Orthogonal interconnection of switching fabric modules and service card modules eliminates circuit on the backplane and thus significantly reduces signal attenuation and data transmit latency.
Compact chassis design, smaller, lighter, take S10506X-G for instance, hosts 6 line-card slots in 10U high-performance CLOS+ switch, which can also fit in a regular 600mm depth rack cabinet, greatly saving rack cabinet space.
With Data center-level forwarding architecture, non-backplane Orthogonal CLOS+, providing slot bandwidth up to 3.1Tbps (bidirectional) on S10506X-G/S10506X-G-PoE and 4.6Tbps (bidirectional) on S10508X-G/S10512X-G.
Compliant with 40G,100G and 400G Ethernet standards, high port-density 40G, 100G line cards to build a high-speed network. The S10500X-G takes the lead in 400G Campus scenario, dramatically increases the inter-campus bandwidth, eliminates bandwidth bottleneck, also makes S10500X-G suitable for Date center scenario in the era of AI.
S10500X-G EERN solution (Enhanced Ethernet Ring Network): H3C EERN Hardware Ring network technology provides the most optimal proposal to build long distance Ring structure networks. Ring structure is widely adopted in Transportation, Metro, Railway and Manufacturing industries. Compared to other software Ring protocols, such as RRPP, ERPS, the bandwidth of EERN is much higher, with each ring being a 200G ring and the distance between two sites can be as far as 80KM, and the switchover time is much faster, being less than 3ms. As EERN is running on 1.5 layer, so typical Ethernet protocols can run on EERN. With EERN, customers will no longer need to relay on WAN system to build a long-distance ring network for their business, EERN can be their new and most cost-effective solution.
Thorough system optimization enables S10500X-G to forward traffic within 100 seconds after being powered on, greatly reducing service interruption time.
Large entries cards: with max Mac and Route being larger than 700K, to meet the customers’ high requirements of all kinds of networks.
Ultra-low forwarding latency: can be as less as <1µs to ensure a fluent use experience.
S10500X-G series adopts distributed system design for control engines, detection engines, and maintenance engines to deliver powerful control capability and millisecond-level HA.
Distributed control engines: Each service card is integrated with a control and processing system. It can efficiently process varieties of packets on the control plane, and provide precise control for protocol packets to avoid attacks on the control plane.
Distributed detection engines: Each service card can deploy BFD or OAM to detect faults in milliseconds and interact with control plane protocols for fast failover and convergence to ensure service continuity.
Distributed maintenance engines: The intelligent CPU system supports intelligent power management and status monitoring for key components. It can reduce power impulse, electromagnetic radiation, and power consumption, and prolongs the device lifespan.
S10500X-G Multigigabit Ethernet PoE++ Solution:With 48*10G Multigigabit PoE++ card, S10500X-G can provide an Easy-to-Deploy solution that can grow with customers’ business. It brings 5 times the current speed to the workspace in a way that plugs right into the existing cabling infrastructure, upgrades network capacity without disruption to business, delivers 15W, 30W, 60W and up to 90W (802.3bt standard) PoE out, powering more end-devices – IP phones, IPTVs, cameras, etc.
256bits MACsec capability: MACsec is an industry-standard point-to-point link-level security technology, is supported on all ports on SF card to provide comprehensive Link level security solution, protecting the network from security threats on the deepest data level.
Trusted Computing: With the built-in TPM, S10500X-G brings the security degree of switches to another level, providing multiple features, such as certificate issuance and device self-check functions to build a more secured network.
3ms Hardware BFD: to ensure the network continuity.
M-LAG (Multichassis link aggregation, originated from DRNI): provides device-level redundancy and load-balance through the simplest link aggregation protocol.
IRF2 (Intelligent Resilient Framework): device level reliability technology, virtualizes multiple switches into one virtual IRF system to provide Data Center-class availability, scalability and also simplifies the management complexity. IRF2 system can be formed over a distance of 80 km (49.71 miles).
Supports a variety of high-availability features such as NSF, ISSU, Graceful Restart, Smartlink, etc.
Redundancy design across key components, including MPUs, switch Fabric Units, Fan tray, PSUs, even power switches, maximizing the system availability and guarding the device against emergency and unexpected conditions.
All modules and power supplies are hot swappable.
H3C S10500X-G series can operate in extreme environment reliably for a long time, with a carrier-level reliability of 99.999%.
Embedded NMS Platform (SmartMC) to provide a light-weight, convenient network management solution.
Compatible with both H3C Intelligent SDN campus network solution (AD-Campus) and SDN date center network solution (AD-DC) to build a SDN network with high-level automation, intelligence.
Supports Visualization technologies, INT, gRPC, Netstream, Telemetry Stream, etc.
Complete IPv4/IPv6 dual stack solutions: IPv6 static routing, RIPng, OSPFv3, IS-ISv6, BGP4+ and Pv4/IPv6 multicast.
IPv4-to-IPv6 transition: IPv6 manual tunnel, 6to4 tunnel, ISATAP tunnel, GRE tunnel, and IPv4-compatible automatic tunnel configuration.
H3C S10500X-G has obtained IPv6 ready logo (phase 2), strong evidence that S10500X-G is a mature series ready for commercial IPv6 services.
Strict Front-to-Rear Air Flow: S10500X-G adopts the best heat dissipation design, reducing the mutual airflow resistance between different switches next to each other in the server room to a great degree.
Higher energy efficiency: PSUs of S10500X-G support 10A power supply input, greatly reducing the requirements for the power supply system in server rooms. Behind that, the overall power consumption is much lower thanks to the high power-efficiency features, such as 2-level power supply structure.
Intelligent Cooling system, the fan tray supports intelligent speed adjustment based on real-time temperature monitoring points embedded in the chassis, the speed of the fan is dynamically adjusted to keep the optimal balance between the heat dissipation and power consumption, saving power consumption significantly.
Water-based paint without electroplating for the chassis exterior significantly reduces carbon emissions.
Features | S10506X-G S10506X-G-PoE | S10508X-G | S10512X-G |
Switching capacity | 43.2Tbps/76.8Tbps* | 57.6Tbps/153.6Tbps* | 86.4Tbps/230.4Tbps* |
Forwarding capacity | 19200Mpps | 25600Mpps | 68400Mpps |
MPU slots | 2 | ||
MPU Console Ports | 1x RJ-45 | 1x RJ-45 | 1x RJ-45 |
MPU MGMT Ports | 1x 10/100/1000M RJ-45 1x 1000M SFP | 1x 10/100/1000M RJ-45 1x 1000M SFP | 1x 10/100/1000M RJ-45 1x 1000M SFP |
MPU USB Port | 1 | 1 | 1 |
LPU slots | 6 | 8 | 12 |
Switching fabric module slots | 4 | 6 | 6 |
Fan Trays | 2 | 3 | 3 |
Power modules | 4 (non- PoE)+8 (PoE) | 6 | 8 |
Hardware architecture | Orthogonal CLOS | ||
Redundancy | Redundant MPUs, switching fabric modules, power modules, and fan trays | ||
Operating environment | Temperature: 0℃ to 45℃ (32°F to 113°F) Humidity: 5% to 95% (non-condensing) | ||
Input voltage | AC:100V~240V DC:-48V~-60V | ||
Maximum power consumption | 3012W | 4374W | 6309W |
MTBF(Year) | 36.5 | 27.05 | 21 |
MTTR(Hour) | 0.5 | 0.5 | 0.5 |
Dimension (H x W x D)/mm | 442×440×520 10U | 530×440×640 12RU | 796×440×640 18RU |
Fully loaded weight | S10506X-G: < 85 kg/187.4 lb S10506X-G-PoE: < 95 kg/209lb | < 130 kg < 286.6 lb | < 180 kg < 396.8 lb |
S10500X-G incorporates the following advanced designs:
CLOS+ architecture and non-backplane design: Data center level forwarding architecture, separates the forwarding plane and control plane completely and high level of bandwidth scalability, building a non-blocking campus network.
Orthogonal interconnection of switching fabric modules and service card modules eliminates circuit on the backplane and thus significantly reduces signal attenuation and data transmit latency.
Compact chassis design, smaller, lighter, take S10506X-G for instance, hosts 6 line-card slots in 10U high-performance CLOS+ switch, which can also fit in a regular 600mm depth rack cabinet, greatly saving rack cabinet space.
With Data center-level forwarding architecture, non-backplane Orthogonal CLOS+, providing slot bandwidth up to 3.1Tbps (bidirectional) on S10506X-G/S10506X-G-PoE and 4.6Tbps (bidirectional) on S10508X-G/S10512X-G.
Compliant with 40G,100G and 400G Ethernet standards, high port-density 40G, 100G line cards to build a high-speed network. The S10500X-G takes the lead in 400G Campus scenario, dramatically increases the inter-campus bandwidth, eliminates bandwidth bottleneck, also makes S10500X-G suitable for Date center scenario in the era of AI.
S10500X-G EERN solution (Enhanced Ethernet Ring Network): H3C EERN Hardware Ring network technology provides the most optimal proposal to build long distance Ring structure networks. Ring structure is widely adopted in Transportation, Metro, Railway and Manufacturing industries. Compared to other software Ring protocols, such as RRPP, ERPS, the bandwidth of EERN is much higher, with each ring being a 200G ring and the distance between two sites can be as far as 80KM, and the switchover time is much faster, being less than 3ms. As EERN is running on 1.5 layer, so typical Ethernet protocols can run on EERN. With EERN, customers will no longer need to relay on WAN system to build a long-distance ring network for their business, EERN can be their new and most cost-effective solution.
Thorough system optimization enables S10500X-G to forward traffic within 100 seconds after being powered on, greatly reducing service interruption time.
Large entries cards: with max Mac and Route being larger than 700K, to meet the customers’ high requirements of all kinds of networks.
Ultra-low forwarding latency: can be as less as <1µs to ensure a fluent use experience.
S10500X-G series adopts distributed system design for control engines, detection engines, and maintenance engines to deliver powerful control capability and millisecond-level HA.
Distributed control engines: Each service card is integrated with a control and processing system. It can efficiently process varieties of packets on the control plane, and provide precise control for protocol packets to avoid attacks on the control plane.
Distributed detection engines: Each service card can deploy BFD or OAM to detect faults in milliseconds and interact with control plane protocols for fast failover and convergence to ensure service continuity.
Distributed maintenance engines: The intelligent CPU system supports intelligent power management and status monitoring for key components. It can reduce power impulse, electromagnetic radiation, and power consumption, and prolongs the device lifespan.
S10500X-G Multigigabit Ethernet PoE++ Solution:With 48*10G Multigigabit PoE++ card, S10500X-G can provide an Easy-to-Deploy solution that can grow with customers’ business. It brings 5 times the current speed to the workspace in a way that plugs right into the existing cabling infrastructure, upgrades network capacity without disruption to business, delivers 15W, 30W, 60W and up to 90W (802.3bt standard) PoE out, powering more end-devices – IP phones, IPTVs, cameras, etc.
256bits MACsec capability: MACsec is an industry-standard point-to-point link-level security technology, is supported on all ports on SF card to provide comprehensive Link level security solution, protecting the network from security threats on the deepest data level.
Trusted Computing: With the built-in TPM, S10500X-G brings the security degree of switches to another level, providing multiple features, such as certificate issuance and device self-check functions to build a more secured network.
3ms Hardware BFD: to ensure the network continuity.
M-LAG (Multichassis link aggregation, originated from DRNI): provides device-level redundancy and load-balance through the simplest link aggregation protocol.
IRF2 (Intelligent Resilient Framework): device level reliability technology, virtualizes multiple switches into one virtual IRF system to provide Data Center-class availability, scalability and also simplifies the management complexity. IRF2 system can be formed over a distance of 80 km (49.71 miles).
Supports a variety of high-availability features such as NSF, ISSU, Graceful Restart, Smartlink, etc.
Redundancy design across key components, including MPUs, switch Fabric Units, Fan tray, PSUs, even power switches, maximizing the system availability and guarding the device against emergency and unexpected conditions.
All modules and power supplies are hot swappable.
H3C S10500X-G series can operate in extreme environment reliably for a long time, with a carrier-level reliability of 99.999%.
Embedded NMS Platform (SmartMC) to provide a light-weight, convenient network management solution.
Compatible with both H3C Intelligent SDN campus network solution (AD-Campus) and SDN date center network solution (AD-DC) to build a SDN network with high-level automation, intelligence.
Supports Visualization technologies, INT, gRPC, Netstream, Telemetry Stream, etc.
Complete IPv4/IPv6 dual stack solutions: IPv6 static routing, RIPng, OSPFv3, IS-ISv6, BGP4+ and Pv4/IPv6 multicast.
IPv4-to-IPv6 transition: IPv6 manual tunnel, 6to4 tunnel, ISATAP tunnel, GRE tunnel, and IPv4-compatible automatic tunnel configuration.
H3C S10500X-G has obtained IPv6 ready logo (phase 2), strong evidence that S10500X-G is a mature series ready for commercial IPv6 services.
Strict Front-to-Rear Air Flow: S10500X-G adopts the best heat dissipation design, reducing the mutual airflow resistance between different switches next to each other in the server room to a great degree.
Higher energy efficiency: PSUs of S10500X-G support 10A power supply input, greatly reducing the requirements for the power supply system in server rooms. Behind that, the overall power consumption is much lower thanks to the high power-efficiency features, such as 2-level power supply structure.
Intelligent Cooling system, the fan tray supports intelligent speed adjustment based on real-time temperature monitoring points embedded in the chassis, the speed of the fan is dynamically adjusted to keep the optimal balance between the heat dissipation and power consumption, saving power consumption significantly.
Water-based paint without electroplating for the chassis exterior significantly reduces carbon emissions.
Features | S10506X-G S10506X-G-PoE | S10508X-G | S10512X-G |
Switching capacity | 43.2Tbps/76.8Tbps* | 57.6Tbps/153.6Tbps* | 86.4Tbps/230.4Tbps* |
Forwarding capacity | 19200Mpps | 25600Mpps | 68400Mpps |
MPU slots | 2 | ||
MPU Console Ports | 1x RJ-45 | 1x RJ-45 | 1x RJ-45 |
MPU MGMT Ports | 1x 10/100/1000M RJ-45 1x 1000M SFP | 1x 10/100/1000M RJ-45 1x 1000M SFP | 1x 10/100/1000M RJ-45 1x 1000M SFP |
MPU USB Port | 1 | 1 | 1 |
LPU slots | 6 | 8 | 12 |
Switching fabric module slots | 4 | 6 | 6 |
Fan Trays | 2 | 3 | 3 |
Power modules | 4 (non- PoE)+8 (PoE) | 6 | 8 |
Hardware architecture | Orthogonal CLOS | ||
Redundancy | Redundant MPUs, switching fabric modules, power modules, and fan trays | ||
Operating environment | Temperature: 0℃ to 45℃ (32°F to 113°F) Humidity: 5% to 95% (non-condensing) | ||
Input voltage | AC:100V~240V DC:-48V~-60V | ||
Maximum power consumption | 3012W | 4374W | 6309W |
MTBF(Year) | 36.5 | 27.05 | 21 |
MTTR(Hour) | 0.5 | 0.5 | 0.5 |
Dimension (H x W x D)/mm | 442×440×520 10U | 530×440×640 12RU | 796×440×640 18RU |
Fully loaded weight | S10506X-G: < 85 kg/187.4 lb S10506X-G-PoE: < 95 kg/209lb | < 130 kg < 286.6 lb | < 180 kg < 396.8 lb |